FR-4 Copper Clad Laminate Sheet
FR-4 copper clad laminate sheet made from epoxy fiberglass substrate clad with thin refined copper foil on one or both sides, foil thickness under 0.15 mm excluding backing. Used as the base material for printed circuit boards.
Import Duty Rates by Country of Origin
| Origin Country | MFN Tariff | Surtaxes | Total Effective Rate |
|---|---|---|---|
| 🇨🇳China | Free | — | Free |
| 🇲🇽Mexico | Free | — | Free |
| 🇺🇸United States | Free | — | Free |
| 🇩🇪Germany | Free | — | Free |
| 🇯🇵Japan | Free | — | Free |
More Specific Codes
This product may fall under a more specific subheading:
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If the copper foil is unbacked
Unbacked refined copper foil is classified under a different item.
Not sure which classification is right?
The Tariff Assistant works through the GRI rules on your specific product to reach the right tariff item — and can price the duty on it in the same conversation.
Import Tips & Compliance
• Ensure the copper foil is refined copper and the backing is FR-4 material
• Keep documentation of foil thickness and substrate composition for CBSA
• Verify if the product qualifies for duty-free treatment under trade agreements
Related Products under Tariff item 7410.21.00
Aluminum-Backed Copper Clad Laminate
Aluminum-backed copper clad laminate consisting of refined copper foil laminated to a thin aluminum substrate, used for metal-core PCBs in LED lighting. The copper foil is 0.15 mm or less in thickness, and the aluminum backing provides thermal management for high-power applications.
CEM-1 Copper Clad Board
CEM-1 copper clad board with refined copper foil cladding 0.15 mm or less on a cost-effective phenolic paper substrate, used for single-sided PCBs. The copper foil is backed by the CEM-1 material, which is a composite of paper and resin.
Copper Clad Invincible Laminate for RF
Specialty ceramic-filled laminate for RF applications with refined copper cladding 0.15 mm or less in thickness. The ceramic-filled polymer backing provides stable dielectric properties for high-frequency circuits.
Double-Sided 1.6mm FR4 Copper Clad Laminate
Double-sided 1.6mm FR4 copper clad laminate with refined copper foil on both sides, each foil layer 0.15 mm or less. The FR4 glass epoxy substrate provides mechanical strength and electrical insulation for PCB manufacturing.
High-Tg FR4 Copper Clad Laminate
High-Tg FR4 copper clad laminate with high glass transition temperature for lead-free soldering, clad with refined copper foil less than 0.15 mm. The high-Tg resin system provides thermal stability for demanding applications.
Polyimide Copper Clad Laminate
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