Aluminum-Backed Copper Clad Laminate for LEDs
Aluminum-backed copper clad laminate used in LED manufacturing, consisting of an aluminum substrate bonded to refined copper foil no thicker than 0.15 mm. The copper layer forms the circuitry traces while the aluminum base dissipates heat in high-power LED applications. It is classified under tariff item 7410.21.00 as backed copper foil of refined copper.
Import Duty Rates by Country of Origin
| Origin Country | MFN Tariff | Surtaxes | Total Effective Rate |
|---|---|---|---|
| π¨π³China | Free | β | Free |
| π²π½Mexico | Free | β | Free |
| πΊπΈUnited States | Free | β | Free |
| π©πͺGermany | Free | β | Free |
| π―π΅Japan | Free | β | Free |
More Specific Codes
This product may fall under a more specific subheading:
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If the copper foil is not backed with any substrate
Unbacked refined copper foil falls under this alternative tariff item.
If the laminate is already printed with circuits
Printed circuit boards are classified in Chapter 85, not as copper foil.
Not sure which classification is right?
The Tariff Assistant works through the GRI rules on your specific product to reach the right tariff item β and can price the duty on it in the same conversation.
Import Tips & Compliance
β’ Ensure the copper foil thickness (excluding the aluminum backing) does not exceed 0.15 mm to qualify for this tariff item
β’ Provide a mill certificate or technical datasheet to the CBSA confirming the refined copper content and foil thickness
β’ If the laminate includes additional insulating layers, verify whether it may be classified elsewhere
Related Products under Tariff item 7410.21.00
1.6mm Double-Sided FR4 Copper Clad Laminate
Standard 1.6 mm thick double-sided copper clad laminate with FR-4 glass epoxy substrate and 1 oz refined copper foil on both sides. Each foil layer is 0.035 mm thick, well under the 0.15 mm limit. This product is used for prototyping and production PCBs and falls under tariff item 7410.21.00.
1oz/1oz Double-Sided FR4 Copper Clad Laminate
Double-sided FR4 copper clad laminate with 1 oz copper weight per side, totaling 70 ΞΌm of copper foil thickness, well under 0.15 mm. The glass epoxy base provides structural support for general purpose rigid PCBs. This product falls under tariff item 7410.21.00 as backed copper foil of refined copper.
2-Layer PCB Copper Clad Laminate Panel
Standard panel-sized double-sided copper clad laminate for 2-layer PCB production, featuring a 1.6 mm FR-4 glass epoxy core with 1 oz refined copper on both sides. The copper foil thickness is within the 0.15 mm limit. This essential raw material for electronic assembly falls under tariff item 7410.21.00.
Aluminum-Backed Copper Clad Laminate
Aluminum-backed copper clad laminate consisting of refined copper foil laminated to a thin aluminum substrate, used for metal-core PCBs in LED lighting. The copper foil thickness does not exceed 0.15 mm, and the aluminum backing is considered a similar backing material under the heading.
Aluminum-Backed Copper Clad? No - Double Copper FR4
Pure double-sided refined copper clad FR4 laminate with no metal core, using plastics-impregnated glass base with 0.5 oz copper on both sides. The copper foil thickness is well under 0.15 mm. This essential electronics industry raw material for high-volume PCB fabrication falls under tariff item 7410.21.00.
BT Resin Copper Clad Laminate for IC Substrates
BT resin copper clad laminate for IC substrates, featuring ultra-thin refined copper foil of 0.15 mm or less on a bismaleimide-triazine resin backing. It is engineered for semiconductor packaging substrates requiring high-density interconnect capability. This product falls under tariff item 7410.21.00 as backed copper foil of refined copper.