New

Ask Wove anything about tariffs.

Try Tariff Assistant

Double-Sided 1.6mm FR4 Copper Clad Laminate

Double-sided 1.6mm FR4 copper clad laminate with refined copper foil on both sides, each foil layer 0.15 mm or less. The FR4 glass epoxy substrate provides mechanical strength and electrical insulation for PCB manufacturing.

Import Duty Rates by Country of Origin

Origin CountryMFN TariffSurtaxesTotal Effective Rate
πŸ‡¨πŸ‡³ChinaFreeβ€”Free
πŸ‡²πŸ‡½MexicoFreeβ€”Free
πŸ‡ΊπŸ‡ΈUnited StatesFreeβ€”Free
πŸ‡©πŸ‡ͺGermanyFreeβ€”Free
πŸ‡―πŸ‡΅JapanFreeβ€”Free

More Specific Codes

This product may fall under a more specific subheading:

Alternative Classifications

This product could be classified differently depending on its characteristics or intended use.

7410.11.00Same rate: Free

If the copper foil is not backed

Unbacked refined copper foil is classified separately.

Not sure which classification is right?

The Tariff Assistant works through the GRI rules on your specific product to reach the right tariff item β€” and can price the duty on it in the same conversation.

Import Tips & Compliance

β€’ Verify both copper foil layers are 0.15 mm or less and made of refined copper

β€’ Provide the substrate composition (FR4) to the CBSA for classification

β€’ Consider whether the laminate qualifies for preferential duty rates under trade agreements

Related Products under Tariff item 7410.21.00

Aluminum-Backed Copper Clad Laminate

Aluminum-backed copper clad laminate consisting of refined copper foil laminated to a thin aluminum substrate, used for metal-core PCBs in LED lighting. The copper foil is 0.15 mm or less in thickness, and the aluminum backing provides thermal management for high-power applications.

CEM-1 Copper Clad Board

CEM-1 copper clad board with refined copper foil cladding 0.15 mm or less on a cost-effective phenolic paper substrate, used for single-sided PCBs. The copper foil is backed by the CEM-1 material, which is a composite of paper and resin.

Copper Clad Invincible Laminate for RF

Specialty ceramic-filled laminate for RF applications with refined copper cladding 0.15 mm or less in thickness. The ceramic-filled polymer backing provides stable dielectric properties for high-frequency circuits.

FR-4 Copper Clad Laminate Sheet

FR-4 copper clad laminate sheet made from epoxy fiberglass substrate clad with thin refined copper foil on one or both sides, foil thickness under 0.15 mm excluding backing. Used as the base material for printed circuit boards.

High-Tg FR4 Copper Clad Laminate

High-Tg FR4 copper clad laminate with high glass transition temperature for lead-free soldering, clad with refined copper foil less than 0.15 mm. The high-Tg resin system provides thermal stability for demanding applications.

Polyimide Copper Clad Laminate

Polyimide copper clad laminate with high-temperature polyimide film backed with refined copper foil 0.15 mm or less, used for flexible PCBs. The polyimide backing provides flexibility and thermal resistance.