QFN-64 Package Substrate with Solder Balls
An organic substrate in QFN-64 format pre-attached with BGA-style solder balls, used for quad flat no-lead IC packaging. This substrate provides the electrical interconnect between the die and the printed circuit board. It is classified under tariff item 8542.90.00 as a part of electronic integrated circuits.
Import Duty Rates by Country of Origin
| Origin Country | MFN Tariff | Surtaxes | Total Effective Rate |
|---|---|---|---|
| 🇨🇳China | Free | — | Free |
| 🇲🇽Mexico | Free | — | Free |
| 🇺🇸United States | Free | — | Free |
| 🇩🇪Germany | Free | — | Free |
| 🇯🇵Japan | Free | — | Free |
PGA flags
No agency flag on this HTS number in the CBSA Single Window matching criteria.
CBSA Single Window matching criteria, unknown
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If the substrate is a bare printed circuit board without solder balls
Printed circuits are classified in heading 85.34.
If the substrate includes an active die
Processors and controllers with active elements are classified as electronic integrated circuits.
Not sure which classification is right?
The Tariff Assistant works through the GRI rules on your specific product to reach the right tariff item — and can price the duty on it in the same conversation.
Import Tips & Compliance
• Specify the substrate's layer count, trace width, and solder ball pitch to support classification
• If the substrate is imported with a die attached, it may be classified as a complete IC
• Ensure the substrate is not classified as a printed circuit board of heading 85.34
Related Products under Tariff item 8542.90.00
BGA Heat Spreader Lid for Processor ICs
A precision-machined copper or aluminum lid assembly with thermal interface material, designed to be attached to BGA integrated circuit packages. It serves as a protective and heat-dissipating component, integral to the physical structure of the IC package. As a part of electronic integrated circuits, it is classified under tariff item 8542.90.00.
Embedded Multi-Die Interconnect Bridge (EMIB) Carrier
A silicon bridge carrier with embedded traces used in Intel EMIB technology to connect multiple dies within a single package. This component enables high-density interconnects between chiplets, functioning as an integral part of an electronic integrated circuit. It is classified under tariff item 8542.90.00 as a part of electronic integrated circuits.
Fan-Out Wafer Level Packaging Mold Frame
A precision metal mold frame used in fan-out wafer level packaging (FOWLP) compression molding processes. This frame holds the wafer during encapsulation, ensuring proper alignment and shape of the molded package. As a specialized tool for IC packaging, it is classified under tariff item 8542.90.00 as a part of electronic integrated circuits.
Flip-Chip Bumps Preform Array for GPU ICs
A solder micro-bump preform array on a carrier film, used for flip-chip bonding of GPU integrated circuits. This component provides the necessary solder bumps for electrical and mechanical connection between the die and substrate. It is classified under tariff item 8542.90.00 as a part of electronic integrated circuits.
Gold Wire Bonding Wedge Tool
A tungsten carbide wedge tool used for thermosonic gold wire bonding of IC leads to die pads. This tool is a critical consumable in the wire bonding process, shaping the wire and transmitting ultrasonic energy. It is classified under tariff item 8542.90.00 as a specialized part for electronic integrated circuit assembly.
IC Die Attach Film Frame
A pressure-sensitive adhesive film mounted on a metal frame, used for wafer dicing and IC die attachment during packaging. This film holds the wafer in place during cutting and provides a carrier for die pick-and-place operations. It is classified under tariff item 8542.90.00 as a part of electronic integrated circuits.