QFN-64 Package Substrate with Solder Balls from United States
An organic substrate in QFN-64 format pre-attached with BGA-style solder balls for quad flat no-lead IC packaging. This substrate serves as the interconnect base for the IC die, providing electrical pathways. It is classified as a part of electronic integrated circuits under tariff item 8542.90.00, as it is a specialized component for IC packaging.
Duty Rate — United States → Canada
0%
Import Tips
• Provide technical drawings showing the substrate's circuit layout and solder ball configuration
• Classify the substrate as a part of ICs, not as a printed circuit
• Ensure the product is not declared as a complete IC package, which would fall under heading 85.42