QFN-64 Package Substrate with Solder Balls from United States
An organic substrate in QFN-64 format pre-attached with BGA-style solder balls, used for quad flat no-lead IC packaging. This substrate provides the electrical interconnect between the die and the printed circuit board. It is classified under tariff item 8542.90.00 as a part of electronic integrated circuits.
Duty Rate — United States → Canada
0%
PGA flags
No agency flag on this HTS number in the CBSA Single Window matching criteria.
CBSA Single Window matching criteria, unknown
Import Tips
• Specify the substrate's layer count, trace width, and solder ball pitch to support classification
• If the substrate is imported with a die attached, it may be classified as a complete IC
• Ensure the substrate is not classified as a printed circuit board of heading 85.34