8542.90.00/Flip-Chip Bumps Preform Array for GPU ICs/China

Flip-Chip Bumps Preform Array for GPU ICs from China

A solder micro-bump preform array on a carrier film, used for flip-chip bonding of GPU integrated circuits. This component provides the necessary solder bumps for electrical and mechanical connection between the die and substrate. It is classified under tariff item 8542.90.00 as a part of electronic integrated circuits.

Duty Rate — China → Canada

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Import Tips

• Specify the solder composition and bump dimensions in the import documentation

• Confirm that the preform is not classified as a separate article of solder (e.g

• under heading 83.11)

• If the carrier film is included, ensure it is presented as part of the preform assembly