BGA Heat Spreader Lid for Processor ICs from United States
A precision-machined copper or aluminum lid assembly with thermal interface material, designed to be attached to BGA integrated circuit packages. It serves as a protective and heat-dissipating component, integral to the physical structure of the IC package. As a part of electronic integrated circuits, it is classified under tariff item 8542.90.00.
Duty Rate — United States → Canada
0%
Import Tips
• Ensure the lid is declared as a part of electronic integrated circuits, not as a general metal article, to avoid misclassification
• Provide technical specifications, such as material composition and dimensions, to support the classification
• Verify whether the product qualifies for duty-free treatment under any free trade agreements