Silicon Die Spacer Wafer from Japan
A thin silicon wafer with through-holes used as spacers in 3D IC stacking for precise die-to-die alignment. This spacer maintains consistent separation between stacked dies and facilitates vertical integration. It is classified under tariff item 8542.90.00 as a part of electronic integrated circuits.
Duty Rate — Japan → Canada
0%
Import Tips
• Describe the spacer's function in maintaining die alignment and its through-hole structure
• Provide the wafer's diameter, thickness, and hole pattern specifications
• If the spacer is coated with conductive materials, note that it may be classified differently