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8542.90.00/Interposer Substrate for 2.5D IC Packaging/Japan

Interposer Substrate for 2.5D IC Packaging from Japan

A silicon interposer substrate with through-silicon vias (TSV) used in 2.5D IC packaging for heterogeneous integration of logic and memory ICs. This substrate provides high-bandwidth interconnects between multiple dies. It is classified under tariff item 8542.90.00 as a part of electronic integrated circuits.

Duty Rate — Japan → Canada

0%
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Import Tips

• Document the interposer's role in enabling die-to-die communication and its TSV structure

• Include technical drawings showing the via layout and metallization

• If the interposer is imported with active dies attached, it may be classified as a complete IC

Interposer Substrate for 2.5D IC Packaging from Japan — Import Duty Rate | Tariff item 8542.90.00