Interposer Substrate for 2.5D IC Packaging from Germany
A silicon interposer substrate with through-silicon vias (TSV) for 2.5D heterogeneous integration of logic and memory ICs. This substrate provides high-bandwidth interconnects between multiple dies. It is classified as a part of electronic integrated circuits under tariff item 8542.90.00, enabling advanced packaging solutions.
Duty Rate — Germany → Canada
0%
Import Tips
• Provide technical documentation showing the TSV structure and its role in 2.5D packaging
• Classify the interposer as a part of ICs, not as a complete semiconductor device
• Ensure the product is not declared as a printed circuit, which would fall under heading 85.34