Wafer Lapping Plate

Cast iron or ceramic lapping plate for double-sided wafer lappers that achieve total thickness variation (TTV) <1μm on silicon wafers (8465 preparation equipment). Features precise flatness and conditioning ring compatibility. 8466.92.50 part for heading 8465 machines.

Import Duty Rates by Country of Origin

Origin CountryMFN RateCh.99 SurchargesTotal Effective Rate
🇨🇳China4.7%+35.0%39.7%
🇲🇽Mexico4.7%+10.0%14.7%
🇨🇦Canada4.7%+10.0%14.7%
🇩🇪Germany4.7%+10.0%14.7%
🇯🇵Japan4.7%+10.0%14.7%

More Specific Codes

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Alternative Classifications

This product could be classified differently depending on its characteristics or intended use.

8466.94.85Same rate: 39.7%

If for machines of headings 8456-8461, not 8465

Parts classification follows principal machine heading; 8465 specificity required here.

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Import Tips & Compliance

Certify plate flatness specs (<0.5μm) and compatibility with specific lapping machines

Document slurry compatibility and semiconductor-only end use

Related Products under HTS 8466.92.50

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