Wafer Lapping Plate from China
Cast iron or ceramic lapping plate for double-sided wafer lappers that achieve total thickness variation (TTV) <1μm on silicon wafers (8465 preparation equipment). Features precise flatness and conditioning ring compatibility. 8466.92.50 part for heading 8465 machines.
Duty Rate — China → United States
42.2%
Rate breakdown
9903.88.0125%Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
9903.05.3112.5%Section 301 (forced labor) — additional 12.5% ad valorem on products of China
Import Tips
• Certify plate flatness specs (<0.5μm) and compatibility with specific lapping machines
• Document slurry compatibility and semiconductor-only end use