Other
Parts and accessories suitable for use solely or principally with the machines of headings 8456 to 8465, including work or tool holders, self-opening dieheads, dividing heads and other special attachments for the machines; tool holders for any type of tool for working in the hand: > Other: > For machines of heading 8465: > Other
Duty Rate (from China)
Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
Products classified under HTS 8466.92.50
Wafer Grinder Spindle Chuck
Vacuum or mechanical spindle chuck for holding silicon wafers during backgrinding to target thickness (50-100μm) in 8465 grinder machines. Features edge grip and vacuum ports for thin wafer handling. 8466.92.50 tool holder for heading 8465.
Crystal Boule Flattening Fixture
Custom fixture with orientation flats grinding guides for semiconductor crystal grinders (8465). Ensures precise flat positioning indicating crystal orientation and doping type. Special attachment classified 8466.92.50.
Wafer Edge Profiling Tool
Diamond tool for wafer edge grinders creating chip-out resistant edge profiles on semiconductor wafers (8465 equipment). Prevents edge cracking during handling and processing. 8466.92.50 special attachment.
Double-Sided Wafer Lapping Carrier
Precision carrier plate holding multiple wafers between upper/lower lapping plates in double-sided lappers (8465). Ensures parallel thickness reduction. Classified 8466.92.50 work holder.
Czochralski Crystal Puller Spindle Assembly
Precision-engineered spindle assembly designed specifically for Czochralski crystal growers used in semiconductor wafer production under HTS 8465. It rotates the seed crystal during the pulling process to form monocrystalline silicon boules. Classified under 8466.92.50 as a part for machines of heading 8465.
Float Zone Crystal Grower RF Heating Coil
Radio frequency heating coil replacement part for float zone crystal growers that produce high-purity silicon ingots for semiconductor wafers (HTS 8465 machines). It generates the molten zone for zone refining process. Falls under 8466.92.50 as an accessory for heading 8465 equipment.
Semiconductor Wafer Slicing Diamond Saw Blade
Ultra-thin diamond-impregnated saw blade for inner-diameter wafer slicing saws that cut monocrystalline boules into semiconductor wafers (8465 equipment). Features coolant channels and precise kerf for minimal material loss. Classified in 8466.92.50 as a tool holder attachment for heading 8465 machines.
Wafer Crystal Grinder Diamond Wheel
Resin- or metal-bonded diamond grinding wheel for crystal grinders that shape semiconductor boules to precise diameters before wafer slicing (HTS 8465). Achieves flatness specifications critical for wafer uniformity. Under 8466.92.50 as special attachment for heading 8465 machines.
Wafer Lapping Plate
Cast iron or ceramic lapping plate for double-sided wafer lappers that achieve total thickness variation (TTV) <1μm on silicon wafers (8465 preparation equipment). Features precise flatness and conditioning ring compatibility. 8466.92.50 part for heading 8465 machines.
CMP Polishing Head for Semiconductor Wafers
Chemical mechanical planarization (CMP) polishing head with retaining ring and retaining ring extension for wafer polishers (HTS 8465). Applies slurry and pressure for global planarization before device fabrication. Accessory under 8466.92.50 for 8465 machines.