Float Zone Crystal Grower RF Heating Coil
Radio frequency heating coil replacement part for float zone crystal growers that produce high-purity silicon ingots for semiconductor wafers (HTS 8465 machines). It generates the molten zone for zone refining process. Falls under 8466.92.50 as an accessory for heading 8465 equipment.
Import Duty Rates by Country of Origin
| Origin Country | MFN Rate | Ch.99 Surcharges | Total Effective Rate |
|---|---|---|---|
| šØš³China | 4.7% | +35.0% | 39.7% |
| š²š½Mexico | 4.7% | +10.0% | 14.7% |
| šØš¦Canada | 4.7% | +10.0% | 14.7% |
| š©šŖGermany | 4.7% | +10.0% | 14.7% |
| šÆšµJapan | 4.7% | +10.0% | 14.7% |
More Specific Codes
This product may fall under a more specific subheading:
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If sold as general industrial heating equipment
Non-specific heating elements for semiconductor processes fall under electric resistance apparatus.
If for machines of heading 8456 instead of 8465
Principle use with different machine headings changes the parts classification structure.
Not sure which classification is right?
Our AI classifier can analyze your specific product and recommend the correct HTS code with confidence.
Import Tips & Compliance
ā¢ Provide FCC compliance docs for RF components and material safety data for high-vacuum use
ā¢ Document exclusive use in semiconductor crystal growth to prevent reclassification
Related Products under HTS 8466.92.50
Wafer Grinder Spindle Chuck
Vacuum or mechanical spindle chuck for holding silicon wafers during backgrinding to target thickness (50-100Ī¼m) in 8465 grinder machines. Features edge grip and vacuum ports for thin wafer handling. 8466.92.50 tool holder for heading 8465.
Crystal Boule Flattening Fixture
Custom fixture with orientation flats grinding guides for semiconductor crystal grinders (8465). Ensures precise flat positioning indicating crystal orientation and doping type. Special attachment classified 8466.92.50.
Wafer Edge Profiling Tool
Diamond tool for wafer edge grinders creating chip-out resistant edge profiles on semiconductor wafers (8465 equipment). Prevents edge cracking during handling and processing. 8466.92.50 special attachment.
Double-Sided Wafer Lapping Carrier
Precision carrier plate holding multiple wafers between upper/lower lapping plates in double-sided lappers (8465). Ensures parallel thickness reduction. Classified 8466.92.50 work holder.
Czochralski Crystal Puller Spindle Assembly
Precision-engineered spindle assembly designed specifically for Czochralski crystal growers used in semiconductor wafer production under HTS 8465. It rotates the seed crystal during the pulling process to form monocrystalline silicon boules. Classified under 8466.92.50 as a part for machines of heading 8465.
Semiconductor Wafer Slicing Diamond Saw Blade
Ultra-thin diamond-impregnated saw blade for inner-diameter wafer slicing saws that cut monocrystalline boules into semiconductor wafers (8465 equipment). Features coolant channels and precise kerf for minimal material loss. Classified in 8466.92.50 as a tool holder attachment for heading 8465 machines.