Other

Parts and accessories suitable for use solely or principally with the machines of headings 8456 to 8465, including work or tool holders, self-opening dieheads, dividing heads and other special attachments for the machines; tool holders for any type of tool for working in the hand: > Other: > For machines of heading 8465: > Other > Other

Duty Rate (from China)

39.7%
MFN Base Rate4.7%

Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter

Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]

Total Effective Rate39.7%

Products classified under HTS 8466.92.50.90

Wafer Grinder Spindle Bearing Kit

Ultra-precision air bearing kit for wafer grinder spindles (8465), provides sub-micron runout for flatness-critical semiconductor wafer processing. Cleanroom-compatible ceramic hybrid bearings. 8466.92.5050.

Float Zone Crystal Grower RF Heating Coil

Radio frequency heating coil accessory for float zone crystal growers classified in heading 8465, used to melt and zone-refine semiconductor materials like high-purity silicon without crucibles. Critical for producing defect-free monocrystalline ingots for wafer fabrication. Falls under 8466.92.5050 as a principal part for semiconductor processing machines.

Silicon Wafer Crystal Puller Spindle Assembly

Precision-engineered spindle assembly designed for use in Czochralski crystal pullers under HTS 8465, used to rotate and extract monocrystalline silicon boules during semiconductor wafer production. This part ensures stable growth of high-purity crystals essential for slicing into wafers. Classified under 8466.92.5050 as a specific accessory for machines of heading 8465.

Float Zone RF Generator Coupler

Impedance matching coupler for RF generators in float zone crystal growers (8465), optimizes power transfer to induction coil for stable zone melting of semiconductor rods. Frequency-tuned for 300-500kHz operation. Accessory under 8466.92.5050.

Wafer Slicing Diamond Wire Guide Roller

Diamond-impregnated guide roller for inner-diameter wafer slicing saws of heading 8465, maintains tension and alignment of diamond wire during high-precision cuts from silicon boules. Essential for producing thin, damage-free semiconductor wafers. Classified in 8466.92.5050 as a tool-holding accessory for semiconductor wafer prep equipment.

Crystal Boule Grinder Chuck Holder

Vacuum chuck holder accessory for crystal grinders under heading 8465, secures semiconductor boules during diameter and flat grinding to wafer specifications. Features precision alignment for conductivity/resistivity flat indications. 8466.92.5050 covers this work-holding part for semiconductor material preparation.

Semiconductor Wafer Lapping Plate

Cast iron lapping plate for wafer grinders/lappers of heading 8465, provides flat reference surface for bringing silicon wafers to critical thickness tolerances before polishing. Designed for loose abrasive slurry processes in semiconductor fabrication prep. Principal part under 8466.92.5050.

Wafer Polishing Head Assembly

Kinematic polishing head with retaining ring for wafer polishers classified in 8465, applies controlled pressure and slurry distribution for mirror-finish semiconductor wafer surfaces. Essential for final preparation before device fabrication. 8466.92.5050 part for heading 8465 machines.

Czochralski Puller Seed Chuck

Rotatable seed chuck for Czochralski crystal pullers (8465), grips silicon seed crystal to initiate boule growth from molten silicon. Precision temperature-controlled design prevents thermal shock. Specific accessory under 8466.92.5050.

Wafer Slicing Coolant Nozzle Assembly

Precision coolant nozzle manifold for wafer slicing saws (8465), delivers deionized water to diamond wire cut zone preventing thermal damage to silicon wafers. Adjustable flow for 200-450mm wafers. 8466.92.5050 accessory.

Boule Flat Grinder Diamond Dresser

Automated diamond dresser for crystal boule flat grinders (8465), conditions grinding wheel to precise angles indicating crystal orientation (conductivity type). Critical for semiconductor industry standards. Classified 8466.92.5050.

Wafer Edge Grinder Collet Set

Precision collet set for wafer edge grinders (8465), holds 100-450mm wafers during chamfering to prevent handling damage in semiconductor fabs. Quick-change design for production efficiency. 8466.92.5050 work holder.

Crystal Puller Crucible Rotation Mechanism

Quartz crucible rotation drive for Czochralski pullers (8465), ensures uniform dopant distribution and thermal symmetry during silicon boule growth. High-temperature bellows-sealed design. Principal part 8466.92.5050.

Wafer Lapper Slurry Distribution Ring

Perforated slurry distribution ring for wafer lappers (8465), ensures uniform abrasive delivery across platen surface for consistent material removal rates. Semiconductor-grade polymer construction. 8466.92.5050 part.

Crystal Grinder Coolant Filtration Module

Inline coolant filtration module for crystal grinders (8465), removes grinding debris from DI water to protect wafer surface quality during boule processing. 1-5 micron semiconductor-grade filters. Accessory 8466.92.5050.