Wafer Slicing Diamond Wire Guide Roller

Diamond-impregnated guide roller for inner-diameter wafer slicing saws of heading 8465, maintains tension and alignment of diamond wire during high-precision cuts from silicon boules. Essential for producing thin, damage-free semiconductor wafers. Classified in 8466.92.5050 as a tool-holding accessory for semiconductor wafer prep equipment.

Import Duty Rates by Country of Origin

Origin CountryMFN RateCh.99 SurchargesTotal Effective Rate
🇨🇳China4.7%+35.0%39.7%
🇲🇽Mexico4.7%+10.0%14.7%
🇨🇦Canada4.7%+10.0%14.7%
🇩🇪Germany4.7%+10.0%14.7%
🇯🇵Japan4.7%+10.0%14.7%

Alternative Classifications

This product could be classified differently depending on its characteristics or intended use.

8207.19.60Lower: 37.9% vs 39.7%

If marketed as general diamond cutting tools

Interchangeable tools not principally for 8465 machines classified as hand/power tool accessories.

8431.49Lower: 10% vs 39.7%

If for parts of seed/corn slicing machinery

Different end-use machinery in food processing changes classification.

Not sure which classification is right?

Our AI classifier can analyze your specific product and recommend the correct HTS code with confidence.

Import Tips & Compliance

Include wire diameter specs (e.g

0.1-0.3mm) and boule size compatibility in commercial invoice

Certify diamond coating for semiconductor-grade slicing to claim specific heading 8465 accessories

Related Products under HTS 8466.92.50.90

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Ultra-precision air bearing kit for wafer grinder spindles (8465), provides sub-micron runout for flatness-critical semiconductor wafer processing. Cleanroom-compatible ceramic hybrid bearings. 8466.92.5050.

Float Zone Crystal Grower RF Heating Coil

Radio frequency heating coil accessory for float zone crystal growers classified in heading 8465, used to melt and zone-refine semiconductor materials like high-purity silicon without crucibles. Critical for producing defect-free monocrystalline ingots for wafer fabrication. Falls under 8466.92.5050 as a principal part for semiconductor processing machines.

Silicon Wafer Crystal Puller Spindle Assembly

Precision-engineered spindle assembly designed for use in Czochralski crystal pullers under HTS 8465, used to rotate and extract monocrystalline silicon boules during semiconductor wafer production. This part ensures stable growth of high-purity crystals essential for slicing into wafers. Classified under 8466.92.5050 as a specific accessory for machines of heading 8465.

Float Zone RF Generator Coupler

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Crystal Boule Grinder Chuck Holder

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