Wafer Slicing Diamond Wire Guide Roller from China
Diamond-impregnated guide roller for inner-diameter wafer slicing saws of heading 8465, maintains tension and alignment of diamond wire during high-precision cuts from silicon boules. Essential for producing thin, damage-free semiconductor wafers. Classified in 8466.92.5050 as a tool-holding accessory for semiconductor wafer prep equipment.
Duty Rate — China → United States
39.7%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
9903.88.0125%Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
Import Tips
• Include wire diameter specs (e.g
• 0.1-0.3mm) and boule size compatibility in commercial invoice
• Certify diamond coating for semiconductor-grade slicing to claim specific heading 8465 accessories