Wafer Slicing Diamond Wire Guide Roller from Mexico
Diamond-impregnated guide roller for inner-diameter wafer slicing saws of heading 8465, maintains tension and alignment of diamond wire during high-precision cuts from silicon boules. Essential for producing thin, damage-free semiconductor wafers. Classified in 8466.92.5050 as a tool-holding accessory for semiconductor wafer prep equipment.
Duty Rate — Mexico → United States
14.7%
Rate breakdown
9903.05.5510%Except for products described in headings 9903.05.85–9903.05.92 and 9903.05.94, articles the product of Mexico, as provided for in U.S. note 52 to this subchapter
Import Tips
• Include wire diameter specs (e.g
• 0.1-0.3mm) and boule size compatibility in commercial invoice
• Certify diamond coating for semiconductor-grade slicing to claim specific heading 8465 accessories