Wafer Slicing Diamond Wire Guide Roller from Germany
Diamond-impregnated guide roller for inner-diameter wafer slicing saws of heading 8465, maintains tension and alignment of diamond wire during high-precision cuts from silicon boules. Essential for producing thin, damage-free semiconductor wafers. Classified in 8466.92.5050 as a tool-holding accessory for semiconductor wafer prep equipment.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%
Import Tips
• Include wire diameter specs (e.g
• 0.1-0.3mm) and boule size compatibility in commercial invoice
• Certify diamond coating for semiconductor-grade slicing to claim specific heading 8465 accessories