Wafer Slicing Diamond Wire Guide Roller from Japan
Diamond-impregnated guide roller for inner-diameter wafer slicing saws of heading 8465, maintains tension and alignment of diamond wire during high-precision cuts from silicon boules. Essential for producing thin, damage-free semiconductor wafers. Classified in 8466.92.5050 as a tool-holding accessory for semiconductor wafer prep equipment.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
Import Tips
• Include wire diameter specs (e.g
• 0.1-0.3mm) and boule size compatibility in commercial invoice
• Certify diamond coating for semiconductor-grade slicing to claim specific heading 8465 accessories