Wafer Grinder Spindle Chuck
Vacuum or mechanical spindle chuck for holding silicon wafers during backgrinding to target thickness (50-100μm) in 8465 grinder machines. Features edge grip and vacuum ports for thin wafer handling. 8466.92.50 tool holder for heading 8465.
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Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If suitable for general hand-held tool working
Work/tool holders not principally for 8465 machines fall under separate 8466 subheading.
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Import Tips & Compliance
• Specify vacuum specifications and wafer size compatibility (200mm, 300mm, 450mm)
• Prove exclusive use in semiconductor wafer grinding vs general machining
• Avoid classifying as generic work holder under 8466.30 if semiconductor-specific
Related Products under HTS 8466.92.50
Crystal Boule Flattening Fixture
Custom fixture with orientation flats grinding guides for semiconductor crystal grinders (8465). Ensures precise flat positioning indicating crystal orientation and doping type. Special attachment classified 8466.92.50.
Wafer Edge Profiling Tool
Diamond tool for wafer edge grinders creating chip-out resistant edge profiles on semiconductor wafers (8465 equipment). Prevents edge cracking during handling and processing. 8466.92.50 special attachment.
Double-Sided Wafer Lapping Carrier
Precision carrier plate holding multiple wafers between upper/lower lapping plates in double-sided lappers (8465). Ensures parallel thickness reduction. Classified 8466.92.50 work holder.
Czochralski Crystal Puller Spindle Assembly
Precision-engineered spindle assembly designed specifically for Czochralski crystal growers used in semiconductor wafer production under HTS 8465. It rotates the seed crystal during the pulling process to form monocrystalline silicon boules. Classified under 8466.92.50 as a part for machines of heading 8465.
Float Zone Crystal Grower RF Heating Coil
Radio frequency heating coil replacement part for float zone crystal growers that produce high-purity silicon ingots for semiconductor wafers (HTS 8465 machines). It generates the molten zone for zone refining process. Falls under 8466.92.50 as an accessory for heading 8465 equipment.
Semiconductor Wafer Slicing Diamond Saw Blade
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