Wafer Grinder Spindle Chuck from Mexico
Vacuum or mechanical spindle chuck for holding silicon wafers during backgrinding to target thickness (50-100μm) in 8465 grinder machines. Features edge grip and vacuum ports for thin wafer handling. 8466.92.50 tool holder for heading 8465.
Duty Rate — Mexico → United States
14.7%
Rate breakdown
9903.05.5510%Section 301 (forced labor) — additional 10% ad valorem on products of Mexico
Import Tips
• Specify vacuum specifications and wafer size compatibility (200mm, 300mm, 450mm)
• Prove exclusive use in semiconductor wafer grinding vs general machining
• Avoid classifying as generic work holder under 8466.30 if semiconductor-specific