Wafer Grinder Spindle Chuck from Mexico
Vacuum or mechanical spindle chuck for holding silicon wafers during backgrinding to target thickness (50-100μm) in 8465 grinder machines. Features edge grip and vacuum ports for thin wafer handling. 8466.92.50 tool holder for heading 8465.
Duty Rate — Mexico → United States
14.7%
Rate breakdown
9903.05.5510%Except for products described in headings 9903.05.85–9903.05.92 and 9903.05.94, articles the product of Mexico, as provided for in U.S. note 52 to this subchapter
Import Tips
• Specify vacuum specifications and wafer size compatibility (200mm, 300mm, 450mm)
• Prove exclusive use in semiconductor wafer grinding vs general machining
• Avoid classifying as generic work holder under 8466.30 if semiconductor-specific