Wafer Edge Profiling Tool
Diamond tool for wafer edge grinders creating chip-out resistant edge profiles on semiconductor wafers (8465 equipment). Prevents edge cracking during handling and processing. 8466.92.50 special attachment.
Import Duty Rates by Country of Origin
| Origin Country | MFN Rate | Ch.99 Surcharges | Total Effective Rate |
|---|---|---|---|
| šØš³China | 4.7% | +35.0% | 39.7% |
| š²š½Mexico | 4.7% | +10.0% | 14.7% |
| šØš¦Canada | 4.7% | +10.0% | 14.7% |
| š©šŖGermany | 4.7% | +10.0% | 14.7% |
| šÆšµJapan | 4.7% | +10.0% | 14.7% |
More Specific Codes
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Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If generic edge grinding tools
Non-machine-specific diamond tools classify under Chapter 82.
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Import Tips & Compliance
ā¢ Document specific edge profile geometries (e.g
ā¢ full arc, buttress)
ā¢ Edge strength test data showing semiconductor handling requirements
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