Czochralski Crystal Puller Spindle Assembly
Precision-engineered spindle assembly designed specifically for Czochralski crystal growers used in semiconductor wafer production under HTS 8465. It rotates the seed crystal during the pulling process to form monocrystalline silicon boules. Classified under 8466.92.50 as a part for machines of heading 8465.
Import Duty Rates by Country of Origin
| Origin Country | MFN Rate | Ch.99 Surcharges | Total Effective Rate |
|---|---|---|---|
| šØš³China | 4.7% | +35.0% | 39.7% |
| š²š½Mexico | 4.7% | +10.0% | 14.7% |
| šØš¦Canada | 4.7% | +10.0% | 14.7% |
| š©šŖGermany | 4.7% | +10.0% | 14.7% |
| šÆšµJapan | 4.7% | +10.0% | 14.7% |
More Specific Codes
This product may fall under a more specific subheading:
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If used in non-semiconductor industrial machinery
Parts for general-purpose machines fall under transmission shaft headings, not specific to 8465 semiconductor equipment.
If incorporates precision measuring components
Parts of measuring instruments for profile projectors or similar testing devices shift to Chapter 90.
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Import Tips & Compliance
ā¢ Verify compatibility certification with specific 8465 crystal grower models to avoid misclassification
ā¢ Include detailed technical specs and end-use statements proving semiconductor manufacturing application
Related Products under HTS 8466.92.50
Wafer Grinder Spindle Chuck
Vacuum or mechanical spindle chuck for holding silicon wafers during backgrinding to target thickness (50-100Ī¼m) in 8465 grinder machines. Features edge grip and vacuum ports for thin wafer handling. 8466.92.50 tool holder for heading 8465.
Crystal Boule Flattening Fixture
Custom fixture with orientation flats grinding guides for semiconductor crystal grinders (8465). Ensures precise flat positioning indicating crystal orientation and doping type. Special attachment classified 8466.92.50.
Wafer Edge Profiling Tool
Diamond tool for wafer edge grinders creating chip-out resistant edge profiles on semiconductor wafers (8465 equipment). Prevents edge cracking during handling and processing. 8466.92.50 special attachment.
Double-Sided Wafer Lapping Carrier
Precision carrier plate holding multiple wafers between upper/lower lapping plates in double-sided lappers (8465). Ensures parallel thickness reduction. Classified 8466.92.50 work holder.
Float Zone Crystal Grower RF Heating Coil
Radio frequency heating coil replacement part for float zone crystal growers that produce high-purity silicon ingots for semiconductor wafers (HTS 8465 machines). It generates the molten zone for zone refining process. Falls under 8466.92.50 as an accessory for heading 8465 equipment.
Semiconductor Wafer Slicing Diamond Saw Blade
Ultra-thin diamond-impregnated saw blade for inner-diameter wafer slicing saws that cut monocrystalline boules into semiconductor wafers (8465 equipment). Features coolant channels and precise kerf for minimal material loss. Classified in 8466.92.50 as a tool holder attachment for heading 8465 machines.