Wafer Edge Profiling Tool from Japan
Diamond tool for wafer edge grinders creating chip-out resistant edge profiles on semiconductor wafers (8465 equipment). Prevents edge cracking during handling and processing. 8466.92.50 special attachment.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Document specific edge profile geometries (e.g
• full arc, buttress)
• Edge strength test data showing semiconductor handling requirements