Wafer Grinder Spindle Chuck from Germany
Vacuum or mechanical spindle chuck for holding silicon wafers during backgrinding to target thickness (50-100μm) in 8465 grinder machines. Features edge grip and vacuum ports for thin wafer handling. 8466.92.50 tool holder for heading 8465.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Except for products described in headings 9903.05.85–9903.05.92 and 9903.05.97, articles the product of a member state of the European Union, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 10 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Specify vacuum specifications and wafer size compatibility (200mm, 300mm, 450mm)
• Prove exclusive use in semiconductor wafer grinding vs general machining
• Avoid classifying as generic work holder under 8466.30 if semiconductor-specific