Wafer Grinder Spindle Chuck from Japan
Vacuum or mechanical spindle chuck for holding silicon wafers during backgrinding to target thickness (50-100μm) in 8465 grinder machines. Features edge grip and vacuum ports for thin wafer handling. 8466.92.50 tool holder for heading 8465.
Duty Rate — Japan → United States
14.7%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Specify vacuum specifications and wafer size compatibility (200mm, 300mm, 450mm)
• Prove exclusive use in semiconductor wafer grinding vs general machining
• Avoid classifying as generic work holder under 8466.30 if semiconductor-specific