CMP Polishing Head for Semiconductor Wafers
Chemical mechanical planarization (CMP) polishing head with retaining ring and retaining ring extension for wafer polishers (HTS 8465). Applies slurry and pressure for global planarization before device fabrication. Accessory under 8466.92.50 for 8465 machines.
Import Duty Rates by Country of Origin
| Origin Country | MFN Rate | Ch.99 Surcharges | Total Effective Rate |
|---|---|---|---|
| šØš³China | 4.7% | +35.0% | 39.7% |
| š²š½Mexico | 4.7% | +10.0% | 14.7% |
| šØš¦Canada | 4.7% | +10.0% | 14.7% |
| š©šŖGermany | 4.7% | +10.0% | 14.7% |
| šÆšµJapan | 4.7% | +10.0% | 14.7% |
More Specific Codes
This product may fall under a more specific subheading:
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If principally for medical or surgical wafer polishing
CMP heads for medical instruments fall under Chapter 90 medical devices.
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Import Tips & Compliance
ā¢ Include pressure uniformity specs and compatibility with specific CMP platforms (e.g
ā¢ Applied Materials)
ā¢ Chemical resistance certification for slurry types used in semiconductor CMP
Related Products under HTS 8466.92.50
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