CMP Polishing Head for Semiconductor Wafers from Mexico
Chemical mechanical planarization (CMP) polishing head with retaining ring and retaining ring extension for wafer polishers (HTS 8465). Applies slurry and pressure for global planarization before device fabrication. Accessory under 8466.92.50 for 8465 machines.
Duty Rate — Mexico → United States
14.7%
Rate breakdown
9903.05.5510%Except for products described in headings 9903.05.85–9903.05.92 and 9903.05.94, articles the product of Mexico, as provided for in U.S. note 52 to this subchapter
Import Tips
• Include pressure uniformity specs and compatibility with specific CMP platforms (e.g
• Applied Materials)
• Chemical resistance certification for slurry types used in semiconductor CMP