CMP Polishing Head for Semiconductor Wafers from Germany
Chemical mechanical planarization (CMP) polishing head with retaining ring and retaining ring extension for wafer polishers (HTS 8465). Applies slurry and pressure for global planarization before device fabrication. Accessory under 8466.92.50 for 8465 machines.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%
Import Tips
• Include pressure uniformity specs and compatibility with specific CMP platforms (e.g
• Applied Materials)
• Chemical resistance certification for slurry types used in semiconductor CMP