CMP Polishing Head for Semiconductor Wafers from China
Chemical mechanical planarization (CMP) polishing head with retaining ring and retaining ring extension for wafer polishers (HTS 8465). Applies slurry and pressure for global planarization before device fabrication. Accessory under 8466.92.50 for 8465 machines.
Duty Rate — China → United States
42.2%
Rate breakdown
9903.88.0125%Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
9903.05.3112.5%Section 301 (forced labor) — additional 12.5% ad valorem on products of China
Import Tips
• Include pressure uniformity specs and compatibility with specific CMP platforms (e.g
• Applied Materials)
• Chemical resistance certification for slurry types used in semiconductor CMP