Wafer Lapping Plate from Germany
Cast iron or ceramic lapping plate for double-sided wafer lappers that achieve total thickness variation (TTV) <1μm on silicon wafers (8465 preparation equipment). Features precise flatness and conditioning ring compatibility. 8466.92.50 part for heading 8465 machines.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Except for products described in headings 9903.05.85–9903.05.92 and 9903.05.97, articles the product of a member state of the European Union, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 10 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Certify plate flatness specs (<0.5μm) and compatibility with specific lapping machines
• Document slurry compatibility and semiconductor-only end use