Other
Mechanical appliances (whether or not hand operated) for projecting, dispersing or spraying liquids or powders; fire extinguishers, whether or not charged; spray guns and similar appliances; steam or sand blasting machines and similar jet projecting machines; parts thereof: > Other appliances: > Other
Duty Rate (from China)
Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Except as provided in headings 9903.88.12, 9903.88.17, 9903.88.20, 9903.88.54, 9903.88.59, 9903.88.61, 9903.88.63, 9903.88.66, 9903.88.67, 9903.88.68, 9903.88.69, or 9903.88.70, articles the product of China, as provided for in U.S. note 20(c) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(d)
Products classified under HTS 8424.89.90.00
Czochralski Crystal Puller
A mechanical appliance used to grow monocrystalline silicon boules by pulling a seed crystal from molten silicon in the Czochralski process. It projects and controls molten material precisely for semiconductor wafer production, classified under HTS 8424.89.9000 as other appliances for projecting liquids.
Dicing Street Coolant Nozzle Array
Precision nozzle system projecting coolant along dicing streets during wafer sawing to prevent thermal damage. HTS 8424.89.9000 for semiconductor-specific liquid projecting appliances.
Wafer Slicing Diamond Saw
High-precision saw that projects coolant liquid while inner-diameter diamond blade slices semiconductor wafers from crystal boules. HTS 8424.89.9000 covers this as other liquid projecting appliance for semiconductor wafer manufacturing.
Edge Bead Removal Spray Tool
Specialized nozzle array projecting solvent sprays to remove excess photoresist from wafer edges, preventing contamination. Classified HTS 8424.89.9000 for semiconductor-specific liquid projecting appliances.
Hydrofluoric Acid Vapor Etch Sprayer
Controlled vapor sprayer projecting HF vapor for native oxide removal from silicon wafers before processing. Classified HTS 8424.89.9000 as other chemical projecting appliances for semiconductors.
backside Wafer Grind Coolant Dispenser
Liquid dispenser projecting coolant during temporary bond/debond backside wafer grinding for 3D packaging. HTS 8424.89.9000 for semiconductor liquid projecting appliances.
Float Zone Crystal Grower
Specialized machine using zone melting to produce high-purity silicon crystals by projecting and manipulating molten zones along a polycrystalline rod. Falls under HTS 8424.89.9000 for other jet projecting machines used in semiconductor material processing.
Crystal Boule Grinder
Precision grinder that disperses diamond slurry or abrasive liquids to grind semiconductor crystal boules to exact diameter and flat specifications. Classified in HTS 8424.89.9000 as other appliances for projecting/dispersing liquids in wafer preparation.
Wafer Lapping Machine
Machine that projects abrasive slurry onto rotating lapping plates to achieve ultra-flat semiconductor wafer surfaces for fabrication. Classified under HTS 8424.89.9000 for powder/liquid dispersing appliances in wafer processing.
Semiconductor Wafer Polisher
Chemical mechanical polishing (CMP) tool that disperses polishing slurry to planarize wafer surfaces for circuit fabrication. HTS 8424.89.9000 includes such liquid projecting apparatus for semiconductor wafer preparation.
Photoresist Spray Coater
Precision spray appliance projecting photoresist liquids onto semiconductor wafers to create uniform thin films for photolithography. Falls under HTS 8424.89.9000 as other liquid spraying appliances for semiconductor processing.
Semiconductor Developer Spray Apparatus
Spray system projecting alkaline developer solutions to selectively remove exposed photoresist from patterned wafers. HTS 8424.89.9000 covers such chemical liquid projecting appliances in semiconductor fabrication.
Silicon Epitaxy Gas Injector
Precision jet injector projecting precursor gases onto heated wafers for epitaxial layer growth in semiconductor devices. HTS 8424.89.9000 includes gas dispersing jet projecting machines for semiconductor processing.
Wafer Cleaning Megasonic Spray Tank
Ultrasonic spray tank projecting high-frequency cleaning solutions to remove particles from semiconductor wafers between process steps. Falls under HTS 8424.89.9000 for liquid dispersing appliances.
Nanoparticle Slurry Disperser for STI CMP
High-pressure disperser projecting ceria nanoparticle slurry for shallow trench isolation chemical mechanical polishing. Classified HTS 8424.89.9000 for powder/liquid dispersion in semiconductor planarization.