Silicon Epitaxy Gas Injector
Precision jet injector projecting precursor gases onto heated wafers for epitaxial layer growth in semiconductor devices. HTS 8424.89.9000 includes gas dispersing jet projecting machines for semiconductor processing.
Import Duty Rates by Country of Origin
| Origin Country | MFN Rate | Ch.99 Surcharges | Total Effective Rate |
|---|---|---|---|
| 🇨🇳China | 1.8% | +35.0% | 36.8% |
| 🇲🇽Mexico | 1.8% | +10.0% | 11.8% |
| 🇨🇦Canada | 1.8% | +10.0% | 11.8% |
| 🇩🇪Germany | 1.8% | +10.0% | 11.8% |
| 🇯🇵Japan | 1.8% | +10.0% | 11.8% |
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If industrial furnace parts for deposition
Epitaxial reactor chambers classify as heat treatment furnaces.
If mixing/kneading apparatus for semiconductors
Gas mixing manifolds for deposition go to specific 8479 provisions.
If valve regulator assemblies
Gas control valves separate from jet projecting function classify in 8481.
Not sure which classification is right?
Our AI classifier can analyze your specific product and recommend the correct HTS code with confidence.
Import Tips & Compliance
• Provide gas flow uniformity and precursor compatibility documentation
• Classify showerhead separately from reactor chamber if modular
Related Products under HTS 8424.89.90.00
Czochralski Crystal Puller
A mechanical appliance used to grow monocrystalline silicon boules by pulling a seed crystal from molten silicon in the Czochralski process. It projects and controls molten material precisely for semiconductor wafer production, classified under HTS 8424.89.9000 as other appliances for projecting liquids.
Dicing Street Coolant Nozzle Array
Precision nozzle system projecting coolant along dicing streets during wafer sawing to prevent thermal damage. HTS 8424.89.9000 for semiconductor-specific liquid projecting appliances.
Wafer Slicing Diamond Saw
High-precision saw that projects coolant liquid while inner-diameter diamond blade slices semiconductor wafers from crystal boules. HTS 8424.89.9000 covers this as other liquid projecting appliance for semiconductor wafer manufacturing.
Edge Bead Removal Spray Tool
Specialized nozzle array projecting solvent sprays to remove excess photoresist from wafer edges, preventing contamination. Classified HTS 8424.89.9000 for semiconductor-specific liquid projecting appliances.
Hydrofluoric Acid Vapor Etch Sprayer
Controlled vapor sprayer projecting HF vapor for native oxide removal from silicon wafers before processing. Classified HTS 8424.89.9000 as other chemical projecting appliances for semiconductors.
backside Wafer Grind Coolant Dispenser
Liquid dispenser projecting coolant during temporary bond/debond backside wafer grinding for 3D packaging. HTS 8424.89.9000 for semiconductor liquid projecting appliances.