Dicing Street Coolant Nozzle Array
Precision nozzle system projecting coolant along dicing streets during wafer sawing to prevent thermal damage. HTS 8424.89.9000 for semiconductor-specific liquid projecting appliances.
Import Duty Rates by Country of Origin
| Origin Country | MFN Rate | Ch.99 Surcharges | Total Effective Rate |
|---|---|---|---|
| 🇨🇳China | 1.8% | +35.0% | 36.8% |
| 🇲🇽Mexico | 1.8% | +10.0% | 11.8% |
| 🇨🇦Canada | 1.8% | +10.0% | 11.8% |
| 🇩🇪Germany | 1.8% | +10.0% | 11.8% |
| 🇯🇵Japan | 1.8% | +10.0% | 11.8% |
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If other spray nozzles
Standalone spray nozzles without semiconductor specificity classify generally.
If parts/accessories for metalworking machine tools
Dicing saw coolant systems often parts of 8461 saws.
If semiconductor wafer dicing machines
Complete dicing systems captured in statistical note 8479 wafer processing.
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Import Tips & Compliance
• Specify coolant flow rates synchronized with spindle RPM
• Classify with dicing saw as single apparatus if integrated
• Misclassification risk as automotive coolant nozzle to Chapter 84
Related Products under HTS 8424.89.90.00
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