Float Zone Crystal Grower
Specialized machine using zone melting to produce high-purity silicon crystals by projecting and manipulating molten zones along a polycrystalline rod. Falls under HTS 8424.89.9000 for other jet projecting machines used in semiconductor material processing.
Import Duty Rates by Country of Origin
| Origin Country | MFN Rate | Ch.99 Surcharges | Total Effective Rate |
|---|---|---|---|
| 🇨🇳China | Free | +40.0% | 40% |
| 🇲🇽Mexico | Free | +15.0% | 15% |
| 🇨🇦Canada | Free | +15.0% | 15% |
| 🇩🇪Germany | Free | +15.0% | 15% |
| 🇯🇵Japan | Free | +15.0% | 15% |
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If integrated induction heating classified as furnace
Induction furnaces and ovens for industrial melting go to 8514, separate from mechanical projection.
If as classifiable machinery for semiconductor processing
Refrigeration-equipped semiconductor processing machines often fall under 8479 per HTS structure.
If for industrial drying ovens with zone heating
Certain heat treatment machinery without primary projection function classifies in 8419.
Not sure which classification is right?
The Tariff Assistant works through the GRI rules on your specific product to reach the right HTS code — and can price the duty on it in the same conversation.
Import Tips & Compliance
• Submit process flow diagrams showing molten zone projection mechanism to justify 8424 classification
• Label as 'semiconductor crystal grower only' to prevent bulk machinery misclassification
Related Products under HTS 8424.89.90.00
Czochralski Crystal Puller
A mechanical appliance used to grow monocrystalline silicon boules by pulling a seed crystal from molten silicon in the Czochralski process. It projects and controls molten material precisely for semiconductor wafer production, classified under HTS 8424.89.9000 as other appliances for projecting liquids.
Dicing Street Coolant Nozzle Array
Precision nozzle system projecting coolant along dicing streets during wafer sawing to prevent thermal damage. HTS 8424.89.9000 for semiconductor-specific liquid projecting appliances.
Wafer Slicing Diamond Saw
High-precision saw that projects coolant liquid while inner-diameter diamond blade slices semiconductor wafers from crystal boules. HTS 8424.89.9000 covers this as other liquid projecting appliance for semiconductor wafer manufacturing.
Edge Bead Removal Spray Tool
Specialized nozzle array projecting solvent sprays to remove excess photoresist from wafer edges, preventing contamination. Classified HTS 8424.89.9000 for semiconductor-specific liquid projecting appliances.
Hydrofluoric Acid Vapor Etch Sprayer
Controlled vapor sprayer projecting HF vapor for native oxide removal from silicon wafers before processing. Classified HTS 8424.89.9000 as other chemical projecting appliances for semiconductors.
backside Wafer Grind Coolant Dispenser
Liquid dispenser projecting coolant during temporary bond/debond backside wafer grinding for 3D packaging. HTS 8424.89.9000 for semiconductor liquid projecting appliances.