Czochralski Crystal Puller
A mechanical appliance used to grow monocrystalline silicon boules by pulling a seed crystal from molten silicon in the Czochralski process. It projects and controls molten material precisely for semiconductor wafer production, classified under HTS 8424.89.9000 as other appliances for projecting liquids.
Import Duty Rates by Country of Origin
| Origin Country | MFN Rate | Ch.99 Surcharges | Total Effective Rate |
|---|---|---|---|
| 🇨🇳China | 1.8% | +35.0% | 36.8% |
| 🇲🇽Mexico | 1.8% | +10.0% | 11.8% |
| 🇨🇦Canada | 1.8% | +10.0% | 11.8% |
| 🇩🇪Germany | 1.8% | +10.0% | 11.8% |
| 🇯🇵Japan | 1.8% | +10.0% | 11.8% |
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If considered a furnace or oven for melting
Liquid metal handling furnaces classify under heading 8486, not mechanical projecting appliances.
If for general semiconductor manufacturing machines not fitting projection description
Statistical notes direct unlisted semiconductor machines to 8479 machines and mechanical appliances.
If primarily for testing boule quality during growth
Testing machines and apparatus for semiconductor materials fall under Chapter 90 per statistical notes.
Not sure which classification is right?
Our AI classifier can analyze your specific product and recommend the correct HTS code with confidence.
Import Tips & Compliance
• Provide detailed technical specs proving use in semiconductor crystal growth to avoid misclassification as general machinery
• Include end-user certificates from semiconductor fabs for duty preference claims under tech-specific programs
• Verify no fire extinguisher components; common pitfall leads to Chapter 84 reclassification
Related Products under HTS 8424.89.90.00
Dicing Street Coolant Nozzle Array
Precision nozzle system projecting coolant along dicing streets during wafer sawing to prevent thermal damage. HTS 8424.89.9000 for semiconductor-specific liquid projecting appliances.
Wafer Slicing Diamond Saw
High-precision saw that projects coolant liquid while inner-diameter diamond blade slices semiconductor wafers from crystal boules. HTS 8424.89.9000 covers this as other liquid projecting appliance for semiconductor wafer manufacturing.
Edge Bead Removal Spray Tool
Specialized nozzle array projecting solvent sprays to remove excess photoresist from wafer edges, preventing contamination. Classified HTS 8424.89.9000 for semiconductor-specific liquid projecting appliances.
Hydrofluoric Acid Vapor Etch Sprayer
Controlled vapor sprayer projecting HF vapor for native oxide removal from silicon wafers before processing. Classified HTS 8424.89.9000 as other chemical projecting appliances for semiconductors.
backside Wafer Grind Coolant Dispenser
Liquid dispenser projecting coolant during temporary bond/debond backside wafer grinding for 3D packaging. HTS 8424.89.9000 for semiconductor liquid projecting appliances.
Float Zone Crystal Grower
Specialized machine using zone melting to produce high-purity silicon crystals by projecting and manipulating molten zones along a polycrystalline rod. Falls under HTS 8424.89.9000 for other jet projecting machines used in semiconductor material processing.