Machines and apparatus for the manufacture of boules or wafers
Machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays; machines and apparatus specified in note 11(C) to this chapter; parts and accessories: > Machines and apparatus for the manufacture of boules or wafers
Duty Rate (from China)
Except as provided in headings 9903.88.12, 9903.88.17, 9903.88.20, 9903.88.54, 9903.88.59, 9903.88.61, 9903.88.63, 9903.88.66, 9903.88.67, 9903.88.68, 9903.88.69, or 9903.88.70, articles the product of China, as provided for in U.S. note 20(c) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(d)
Articles the product of any country, as provided for in subdivision (aa)(ii) of U.S. note 2 to this subchapter
Products classified under HTS 8486.10.00.00
SEMI Wafer Grinder-Polisher Combo
A combo grinder-polisher performs sequential grinding and polishing in one station for semiconductor wafers, optimizing throughput. Integrated per statistical note. HTS 8486.10.00.00.
Semiconductor Wafer Lapper
A semiconductor wafer lapper uses abrasive slurries to lap wafer surfaces post-slicing, achieving flatness tolerances critical for device fabrication. It prepares wafers within dimensional specs per statistical note. Under HTS 8486.10.00.00 for wafer preparation.
Czochralski Crystal Puller
A Czochralski crystal puller is a machine used to produce extremely pure monocrystalline semiconductor boules, such as silicon, from which wafers are sliced. It employs the Czochralski method by dipping a seed crystal into molten silicon and slowly pulling it upward to form a single crystal boule. This equipment falls under HTS 8486.10.00.00 as it is specifically for the manufacture of semiconductor boules.
Float Zone Crystal Grower
A float zone crystal grower uses the float zone method to produce high-purity monocrystalline silicon boules by melting a polycrystalline rod with a radio-frequency coil and moving the molten zone. It is ideal for oxygen-free crystals used in power semiconductors. Classified under HTS 8486.10.00.00 for boule manufacturing equipment.
Silicon Crystal Grinder
A silicon crystal grinder processes semiconductor boules by grinding them to precise diameters and creating flats that indicate conductivity type and resistivity. It prepares the boule for wafer slicing in semiconductor fabrication. This falls under HTS 8486.10.00.00 as wafer preparation equipment.
Wafer Slicing Diamond Saw
A wafer slicing diamond saw cuts thin wafers from monocrystalline semiconductor boules using a diamond-impregnated blade for minimal kerf loss and high precision. It is essential for wafer preparation in chip manufacturing. HTS 8486.10.00.00 covers this as boule-to-wafer slicing apparatus.
Silicon Wafer Polishing Machine
A silicon wafer polishing machine uses chemical-mechanical planarization (CMP) to create mirror-finish wafer surfaces for semiconductor lithography. It brings wafers to final tolerances before fab processing. Classified in HTS 8486.10.00.00 as wafer preparation apparatus.
Gallium Arsenide Boule Puller
A gallium arsenide boule puller produces monocrystalline GaAs boules using liquid-encapsulated Czochralski method for compound semiconductor applications like LEDs and RF chips. It handles reactive melts per statistical note. HTS 8486.10.00.00 applies to boule makers.
Multi-Wire Wafer Slicing Saw
A multi-wire wafer slicing saw employs diamond wire arrays to simultaneously slice multiple wafers from a boule, minimizing material waste. Used for high-volume silicon wafer production. Falls under HTS 8486.10.00.00 for wafer slicing equipment.
Crystal boule Diameter Grinder
A crystal boule diameter grinder precisely shapes semiconductor boules to uniform diameter before slicing, ensuring consistent wafer thickness. Includes orientation flats for doping identification. HTS 8486.10.00.00 per statistical note (a)(ii)(A).
Automated Wafer Edge Grinder
An automated wafer edge grinder chamfers and profiles wafer edges post-slicing to prevent chipping during handling and processing. Critical for yield in semiconductor fabs. Under HTS 8486.10.00.00 as wafer prep equipment.
Double-Sided Wafer Grinder
A double-sided wafer grinder simultaneously processes both wafer faces to achieve parallel thickness control essential for device uniformity. Uses planetary motion with diamond pads. HTS 8486.10.00.00 for wafer grinding.
Chemical Mechanical Wafer Polisher
A chemical mechanical wafer polisher (CMP) uses slurry and pad to planarize wafers for sub-micron flatness in advanced nodes. Includes in-situ endpoint detection. Classified HTS 8486.10.00.00 as wafer polisher.
Silicon Ingot Grinder
A silicon ingot grinder shapes Czochralski-grown ingots to exact geometry before wire sawing, creating reference flats. Per statistical note for crystal grinders. HTS 8486.10.00.00.
Precision Wafer Slicer
A precision wafer slicer uses inner-diameter diamond saws for kerfless wafering from semiconductor boules. Minimizes waste for thin wafers. HTS 8486.10.00.00.