Semiconductor Wafer Lapper
A semiconductor wafer lapper uses abrasive slurries to lap wafer surfaces post-slicing, achieving flatness tolerances critical for device fabrication. It prepares wafers within dimensional specs per statistical note. Under HTS 8486.10.00.00 for wafer preparation.
Import Duty Rates by Country of Origin
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If lapping machines for general metal or optical use
Non-semiconductor lappers are machine tools, not specialized apparatus.
If includes integrated metrology for testing
Test/measuring machines with lapping function shift to Chapter 90.
Not sure which classification is right?
Our AI classifier can analyze your specific product and recommend the correct HTS code with confidence.
Import Tips & Compliance
• Specify flatness specs (e.g
• <1μm) in docs to distinguish from general polishers
• Check for EPA compliance on slurry chemicals during import
Related Products under HTS 8486.10.00.00
SEMI Wafer Grinder-Polisher Combo
A combo grinder-polisher performs sequential grinding and polishing in one station for semiconductor wafers, optimizing throughput. Integrated per statistical note. HTS 8486.10.00.00.
Czochralski Crystal Puller
A Czochralski crystal puller is a machine used to produce extremely pure monocrystalline semiconductor boules, such as silicon, from which wafers are sliced. It employs the Czochralski method by dipping a seed crystal into molten silicon and slowly pulling it upward to form a single crystal boule. This equipment falls under HTS 8486.10.00.00 as it is specifically for the manufacture of semiconductor boules.
Float Zone Crystal Grower
A float zone crystal grower uses the float zone method to produce high-purity monocrystalline silicon boules by melting a polycrystalline rod with a radio-frequency coil and moving the molten zone. It is ideal for oxygen-free crystals used in power semiconductors. Classified under HTS 8486.10.00.00 for boule manufacturing equipment.
Silicon Crystal Grinder
A silicon crystal grinder processes semiconductor boules by grinding them to precise diameters and creating flats that indicate conductivity type and resistivity. It prepares the boule for wafer slicing in semiconductor fabrication. This falls under HTS 8486.10.00.00 as wafer preparation equipment.
Wafer Slicing Diamond Saw
A wafer slicing diamond saw cuts thin wafers from monocrystalline semiconductor boules using a diamond-impregnated blade for minimal kerf loss and high precision. It is essential for wafer preparation in chip manufacturing. HTS 8486.10.00.00 covers this as boule-to-wafer slicing apparatus.
Silicon Wafer Polishing Machine
A silicon wafer polishing machine uses chemical-mechanical planarization (CMP) to create mirror-finish wafer surfaces for semiconductor lithography. It brings wafers to final tolerances before fab processing. Classified in HTS 8486.10.00.00 as wafer preparation apparatus.