Semiconductor Wafer Lapper from Germany
A semiconductor wafer lapper uses abrasive slurries to lap wafer surfaces post-slicing, achieving flatness tolerances critical for device fabrication. It prepares wafers within dimensional specs per statistical note. Under HTS 8486.10.00.00 for wafer preparation.
Duty Rate — Germany → United States
0%
Rate breakdown
9903.05.860%Universal product exemption (U.S. note 52(b))
Import Tips
• Specify flatness specs (e.g
• <1μm) in docs to distinguish from general polishers
• Check for EPA compliance on slurry chemicals during import