8486.10.00.00/Semiconductor Wafer Lapper/Germany

Semiconductor Wafer Lapper from Germany

A semiconductor wafer lapper uses abrasive slurries to lap wafer surfaces post-slicing, achieving flatness tolerances critical for device fabrication. It prepares wafers within dimensional specs per statistical note. Under HTS 8486.10.00.00 for wafer preparation.

Duty Rate — Germany → United States

0%

Rate breakdown

9903.03.030%Articles the product of any country, as provided for in subdivision (aa)(ii) of U.S. note 2 to this subchapter
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Import Tips

• Specify flatness specs (e.g

• <1μm) in docs to distinguish from general polishers

• Check for EPA compliance on slurry chemicals during import