Multi-Wire Wafer Slicing Saw
A multi-wire wafer slicing saw employs diamond wire arrays to simultaneously slice multiple wafers from a boule, minimizing material waste. Used for high-volume silicon wafer production. Falls under HTS 8486.10.00.00 for wafer slicing equipment.
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Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If wire saws for stone/glass cutting
Non-precision wire saws are general sawing machines.
If for display glass boule slicing
Machinery for glass/display in 8439 if not semiconductor.
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Import Tips & Compliance
• Specify wire diameter (<100μm) and slice count capability for classification
• Coolant system specs needed for process validation
Related Products under HTS 8486.10.00.00
SEMI Wafer Grinder-Polisher Combo
A combo grinder-polisher performs sequential grinding and polishing in one station for semiconductor wafers, optimizing throughput. Integrated per statistical note. HTS 8486.10.00.00.
Semiconductor Wafer Lapper
A semiconductor wafer lapper uses abrasive slurries to lap wafer surfaces post-slicing, achieving flatness tolerances critical for device fabrication. It prepares wafers within dimensional specs per statistical note. Under HTS 8486.10.00.00 for wafer preparation.
Czochralski Crystal Puller
A Czochralski crystal puller is a machine used to produce extremely pure monocrystalline semiconductor boules, such as silicon, from which wafers are sliced. It employs the Czochralski method by dipping a seed crystal into molten silicon and slowly pulling it upward to form a single crystal boule. This equipment falls under HTS 8486.10.00.00 as it is specifically for the manufacture of semiconductor boules.
Float Zone Crystal Grower
A float zone crystal grower uses the float zone method to produce high-purity monocrystalline silicon boules by melting a polycrystalline rod with a radio-frequency coil and moving the molten zone. It is ideal for oxygen-free crystals used in power semiconductors. Classified under HTS 8486.10.00.00 for boule manufacturing equipment.
Silicon Crystal Grinder
A silicon crystal grinder processes semiconductor boules by grinding them to precise diameters and creating flats that indicate conductivity type and resistivity. It prepares the boule for wafer slicing in semiconductor fabrication. This falls under HTS 8486.10.00.00 as wafer preparation equipment.
Wafer Slicing Diamond Saw
A wafer slicing diamond saw cuts thin wafers from monocrystalline semiconductor boules using a diamond-impregnated blade for minimal kerf loss and high precision. It is essential for wafer preparation in chip manufacturing. HTS 8486.10.00.00 covers this as boule-to-wafer slicing apparatus.