8486.10.00.00/Multi-Wire Wafer Slicing Saw/Germany

Multi-Wire Wafer Slicing Saw from Germany

A multi-wire wafer slicing saw employs diamond wire arrays to simultaneously slice multiple wafers from a boule, minimizing material waste. Used for high-volume silicon wafer production. Falls under HTS 8486.10.00.00 for wafer slicing equipment.

Duty Rate — Germany → United States

0%

Rate breakdown

9903.03.030%Articles the product of any country, as provided for in subdivision (aa)(ii) of U.S. note 2 to this subchapter
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Import Tips

• Specify wire diameter (<100μm) and slice count capability for classification

• Coolant system specs needed for process validation

Multi-Wire Wafer Slicing Saw from Germany — Import Duty Rate | HTS 8486.10.00.00