Multi-Wire Wafer Slicing Saw from China
A multi-wire wafer slicing saw employs diamond wire arrays to simultaneously slice multiple wafers from a boule, minimizing material waste. Used for high-volume silicon wafer production. Falls under HTS 8486.10.00.00 for wafer slicing equipment.
Duty Rate — China → United States
25%
Rate breakdown
9903.88.0225%Except as provided in headings 9903.88.12, 9903.88.17, 9903.88.20, 9903.88.54, 9903.88.59, 9903.88.61, 9903.88.63, 9903.88.66, 9903.88.67, 9903.88.68, 9903.88.69, or 9903.88.70, articles the product of China, as provided for in U.S. note 20(c) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(d)
9903.03.030%Articles the product of any country, as provided for in subdivision (aa)(ii) of U.S. note 2 to this subchapter
Import Tips
• Specify wire diameter (<100μm) and slice count capability for classification
• Coolant system specs needed for process validation