Multi-Wire Wafer Slicing Saw from Mexico
A multi-wire wafer slicing saw employs diamond wire arrays to simultaneously slice multiple wafers from a boule, minimizing material waste. Used for high-volume silicon wafer production. Falls under HTS 8486.10.00.00 for wafer slicing equipment.
Duty Rate — Mexico → United States
0%
Rate breakdown
9903.05.860%Articles provided for in subdivision (b) of U.S. note 52 to this subchapter
Import Tips
• Specify wire diameter (<100μm) and slice count capability for classification
• Coolant system specs needed for process validation