Wafer Slicing Diamond Saw
High-precision saw that projects coolant liquid while inner-diameter diamond blade slices semiconductor wafers from crystal boules. HTS 8424.89.9000 covers this as other liquid projecting appliance for semiconductor wafer manufacturing.
Import Duty Rates by Country of Origin
| Origin Country | MFN Rate | Ch.99 Surcharges | Total Effective Rate |
|---|---|---|---|
| 🇨🇳China | 1.8% | +35.0% | 36.8% |
| 🇲🇽Mexico | 1.8% | +10.0% | 11.8% |
| 🇨🇦Canada | 1.8% | +10.0% | 11.8% |
| 🇩🇪Germany | 1.8% | +10.0% | 11.8% |
| 🇯🇵Japan | 1.8% | +10.0% | 11.8% |
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If classified as sawing machine for metals
Sawing or cutting-off machines working metal classify under heading 8461.
If statistical note semiconductor wafer manufacturing equipment
Unspecified wafer prep machines directed to 8479 semiconductor provisions.
If compound optical microscope integrated for slicing
Microscope compound optical instruments for semiconductor go to 9011.
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Import Tips & Compliance
• Provide blade specifications and coolant flow documentation to distinguish from general saws
• Include vibration isolation test data; critical for semiconductor precision claims
• Avoid 'metal cutting saw' labeling which triggers 8461 classification errors
Related Products under HTS 8424.89.90.00
Czochralski Crystal Puller
A mechanical appliance used to grow monocrystalline silicon boules by pulling a seed crystal from molten silicon in the Czochralski process. It projects and controls molten material precisely for semiconductor wafer production, classified under HTS 8424.89.9000 as other appliances for projecting liquids.
Dicing Street Coolant Nozzle Array
Precision nozzle system projecting coolant along dicing streets during wafer sawing to prevent thermal damage. HTS 8424.89.9000 for semiconductor-specific liquid projecting appliances.
Edge Bead Removal Spray Tool
Specialized nozzle array projecting solvent sprays to remove excess photoresist from wafer edges, preventing contamination. Classified HTS 8424.89.9000 for semiconductor-specific liquid projecting appliances.
Hydrofluoric Acid Vapor Etch Sprayer
Controlled vapor sprayer projecting HF vapor for native oxide removal from silicon wafers before processing. Classified HTS 8424.89.9000 as other chemical projecting appliances for semiconductors.
backside Wafer Grind Coolant Dispenser
Liquid dispenser projecting coolant during temporary bond/debond backside wafer grinding for 3D packaging. HTS 8424.89.9000 for semiconductor liquid projecting appliances.
Float Zone Crystal Grower
Specialized machine using zone melting to produce high-purity silicon crystals by projecting and manipulating molten zones along a polycrystalline rod. Falls under HTS 8424.89.9000 for other jet projecting machines used in semiconductor material processing.