8424.89.90.00/Wafer Slicing Diamond Saw/Japan

Wafer Slicing Diamond Saw from Japan

High-precision saw that projects coolant liquid while inner-diameter diamond blade slices semiconductor wafers from crystal boules. HTS 8424.89.9000 covers this as other liquid projecting appliance for semiconductor wafer manufacturing.

Duty Rate — Japan → United States

11.8%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
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Import Tips

• Provide blade specifications and coolant flow documentation to distinguish from general saws

• Include vibration isolation test data; critical for semiconductor precision claims

• Avoid 'metal cutting saw' labeling which triggers 8461 classification errors

Wafer Slicing Diamond Saw from Japan — Import Duty Rate | HTS 8424.89.90.00