Photoresist Spray Coater
Precision spray appliance projecting photoresist liquids onto semiconductor wafers to create uniform thin films for photolithography. Falls under HTS 8424.89.9000 as other liquid spraying appliances for semiconductor processing.
Import Duty Rates by Country of Origin
| Origin Country | MFN Rate | Ch.99 Surcharges | Total Effective Rate |
|---|---|---|---|
| 🇨🇳China | 1.8% | +35.0% | 36.8% |
| 🇲🇽Mexico | 1.8% | +10.0% | 11.8% |
| 🇨🇦Canada | 1.8% | +10.0% | 11.8% |
| 🇩🇪Germany | 1.8% | +10.0% | 11.8% |
| 🇯🇵Japan | 1.8% | +10.0% | 11.8% |
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If nozzles for agricultural/ horticultural spraying
Spray nozzles without semiconductor specificity classify as general agricultural equipment.
If pattern generating apparatus for semiconductor display
Photolithography coaters for flat panel displays go to 9017 per statistical direction.
If refrigerated photoresist coating equipment
Temperature-controlled semiconductor coating machines classify in 8479.50.
Not sure which classification is right?
Our AI classifier can analyze your specific product and recommend the correct HTS code with confidence.
Import Tips & Compliance
• Provide coating thickness uniformity specs (sub-micron) for semiconductor justification
• Classify spin coater components separately from spray nozzles
Related Products under HTS 8424.89.90.00
Czochralski Crystal Puller
A mechanical appliance used to grow monocrystalline silicon boules by pulling a seed crystal from molten silicon in the Czochralski process. It projects and controls molten material precisely for semiconductor wafer production, classified under HTS 8424.89.9000 as other appliances for projecting liquids.
Dicing Street Coolant Nozzle Array
Precision nozzle system projecting coolant along dicing streets during wafer sawing to prevent thermal damage. HTS 8424.89.9000 for semiconductor-specific liquid projecting appliances.
Wafer Slicing Diamond Saw
High-precision saw that projects coolant liquid while inner-diameter diamond blade slices semiconductor wafers from crystal boules. HTS 8424.89.9000 covers this as other liquid projecting appliance for semiconductor wafer manufacturing.
Edge Bead Removal Spray Tool
Specialized nozzle array projecting solvent sprays to remove excess photoresist from wafer edges, preventing contamination. Classified HTS 8424.89.9000 for semiconductor-specific liquid projecting appliances.
Hydrofluoric Acid Vapor Etch Sprayer
Controlled vapor sprayer projecting HF vapor for native oxide removal from silicon wafers before processing. Classified HTS 8424.89.9000 as other chemical projecting appliances for semiconductors.
backside Wafer Grind Coolant Dispenser
Liquid dispenser projecting coolant during temporary bond/debond backside wafer grinding for 3D packaging. HTS 8424.89.9000 for semiconductor liquid projecting appliances.