Photoresist Spray Coater from Japan
Precision spray appliance projecting photoresist liquids onto semiconductor wafers to create uniform thin films for photolithography. Falls under HTS 8424.89.9000 as other liquid spraying appliances for semiconductor processing.
Duty Rate — Japan → United States
15%
Rate breakdown
9903.82.1015%Except as provided for in headings 9903.82.12, 9903.82.17 and 9903.85.68, derivative aluminum and steel articles with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 15 percent, as provided for in subdivision (f) of U.S. note 16 to this subchapter
9903.05.900%Articles already subject to Section 232 (steel/aluminum/copper + derivatives, autos + parts, wood, medium/heavy vehicles + parts, semiconductors, patented pharma) — U.S. note 52(f)
Import Tips
• Provide coating thickness uniformity specs (sub-micron) for semiconductor justification
• Classify spin coater components separately from spray nozzles