Semiconductor Wafer Polisher
Chemical mechanical polishing (CMP) tool that disperses polishing slurry to planarize wafer surfaces for circuit fabrication. HTS 8424.89.9000 includes such liquid projecting apparatus for semiconductor wafer preparation.
Import Duty Rates by Country of Origin
| Origin Country | MFN Rate | Ch.99 Surcharges | Total Effective Rate |
|---|---|---|---|
| 🇨🇳China | 1.8% | +35.0% | 36.8% |
| 🇲🇽Mexico | 1.8% | +10.0% | 11.8% |
| 🇨🇦Canada | 1.8% | +10.0% | 11.8% |
| 🇩🇪Germany | 1.8% | +10.0% | 11.8% |
| 🇯🇵Japan | 1.8% | +10.0% | 11.8% |
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If fire extinguisher type pressurized slurry systems
Pressurized liquid projecting appliances resemble fire extinguishers in 8424.10.
If other semiconductor processing instruments
Certain micro/nano fabrication instruments classify in 9017.
If apparatus for physical deposition on semiconductors
Chemical vapor deposition with slurry elements goes to specific 8479 provisions.
Not sure which classification is right?
Our AI classifier can analyze your specific product and recommend the correct HTS code with confidence.
Import Tips & Compliance
• Submit CMP process recipes showing slurry projection to validate classification
• Declare pad conditioning system separately if modular; prevents set classification
Related Products under HTS 8424.89.90.00
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