8424.89.90.00/Semiconductor Wafer Polisher/Mexico

Semiconductor Wafer Polisher from Mexico

Chemical mechanical polishing (CMP) tool that disperses polishing slurry to planarize wafer surfaces for circuit fabrication. HTS 8424.89.9000 includes such liquid projecting apparatus for semiconductor wafer preparation.

Duty Rate — Mexico → United States

11.8%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter

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Import Tips

• Submit CMP process recipes showing slurry projection to validate classification

• Declare pad conditioning system separately if modular; prevents set classification